Edge-sealed pad for CMP process

Details Edge-sealed pad for CMP process Edge-sealed pad for CMP process

2005-07-05

2005-07-05

Nguyen, George (Department: 3723)

Abrading

Machine

Rotary tool

C451S921000, C451S533000, C451S530000

Reexamination Certificate

active

06913527

ABSTRACT:
The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention is a composite of a top pad and a sealed sub-pad. The sealed sub-pad has a sealing mechanism that mitigates liquid penetration into the sub-pad thereby maintaining a substantially uniform compressibility of the sub-pad and the polishing pad and extending a useable life of the polishing pad.

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patent: 2001/0005667 (2001-06-01), Tolles et al.

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