Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2005-04-05
2005-04-05
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S037000, C451S056000, C451S058000, C451S526000, C051S298000
Reexamination Certificate
active
06875077
ABSTRACT:
A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
REFERENCES:
patent: 6171181 (2001-01-01), Roberts et al.
patent: 6280289 (2001-08-01), Wiswesser et al.
patent: 6280290 (2001-08-01), Birang et al.
patent: 6517417 (2003-02-01), Budinger et al.
Copper Richard D.
Fathauer Paul
Perry David
Petroski Angela
Much Shelist Freed
Ojini Anthony
Raytech Innovative Solutions, Inc.
Wilson Lee D.
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