Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-07-05
2005-07-05
Chang, Richard (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C427S097100, C427S099300, C438S014000, C438S017000, C438S018000
Reexamination Certificate
active
06912778
ABSTRACT:
A full-wafer probe card, a method for making the probe card and a full-wafer testing system are provided. The probe card includes test probes comprising cantilever elements configured and arranged with probe tips in a pattern corresponding to an array of bond pads of semiconductor dice residing on a device wafer. The probe card is desirably fabricated of the same material, such as silicon, as the device wafer to be tested. The cantilever elements may be fabricated from the material of the probe card substrate using known silicon micro-machining techniques including isotropic and anisotropic etching. Additionally, conductive feedthroughs or vias are formed through the probe card to electrically connect the probe tips with conductive pads on an opposing side of the substrate which interface with test contacts of external test circuitry. The conductive feedthroughs may be formed as coaxial structures, which help to minimize stray capacitance and inductance.
REFERENCES:
patent: 5268571 (1993-12-01), Yamamoto et al.
patent: 5475318 (1995-12-01), Marcus et al.
patent: 5623214 (1997-04-01), Pasiecznik, Jr.
patent: 5642054 (1997-06-01), Pasiecznik, Jr.
patent: 5773780 (1998-06-01), Eldridge et al.
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 6060891 (2000-05-01), Hembree et al.
patent: 6072321 (2000-06-01), Akram et al.
patent: 6100708 (2000-08-01), Mizuta
patent: 6143616 (2000-11-01), Geusic et al.
patent: 6181144 (2001-01-01), Hembree et al.
patent: 6187677 (2001-02-01), Ahn
patent: 6379982 (2002-04-01), Ahn et al.
patent: 6531327 (2003-03-01), Kanamaru et al.
FormFactor WOWs wieth Cost Savings, Electronic Buyer's News (EBUY), Copyright 1998 CMP Publications Inc., Dec. 14, 1998, pp. 7-9.
Beiley et al., A Micromachined Array Probe Card—Fabrication Process, IEEE Transactions on Components Packaging and Manufacturing Technology, Feb. 1995, Part B, vol. 12, No. 1, pp. 179-182.
Arnold et al., Test Methods Used to Produce Hightly Reliable Known Good Die (KDG), 1998 International Conference on Multichip Modules and Hight Density packaging, Dallas, TX, pp. 374-392.
Zhang et al., A New MEMS Wafer Probe Card, Newark, NJ, pp. 395-399.
Smith et al, A New Flip-Chip Technology for High-Density Packaging, 1196 Electronic Components and Technology Confrence, pp. 1069-1073.
Jazairy et al., Very High Aspect Ratio Wafer-Free Silicon Micromechanical Structures, School of Electrical Engineering and the National Nanofabrication Facility, Cornell University, Ithaca, NY, SPIE vol. 2640, pp. 111-120.
Kasukabe et al., Membrane Probe with Pyramidal Tips for a Bare Chip Testing, 1998 International Conference on Multichip Modules and High Density Packaging, pp. 383-387.
Criscuolo, Using Silicon Contacts to Test and Burn-In FLASH Memory, Microprocessors, and FPGA's, 1998 International Conference on Multichip Modules adn High Density Packaging, pp. 388-392.
Ahn Kie Y.
Eldridge Jerome M.
Forbes Leonard
Chang Richard
Micro)n Technology, Inc.
TraskBritt
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