Method of manufacturing a device, device manufacturing...

Details Method of manufacturing a device, device manufacturing... Method of manufacturing a device, device manufacturing...

2005-03-22

2005-03-22

Whitmore, Stacy A. (Department: 2812)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C438S030000, C216S023000

Reexamination Certificate

active

06871339

ABSTRACT:
In a method of manufacturing a device which includes processes in which a plurality of unit regions (first bits D1and second bits D2) are established upon a substrate in the form of a lattice, and in which liquid drops are discharged by an ink device in each unit region, when a first bitmap which is made up from a plurality of the first bits D1and a second bitmap which is made up from a plurality of the second bits D2whose size is different from that of the first bits D1have been established, the highest common divisor of the size of the first bits D1and the size of the second bits D2is calculated, this highest common divisor is taken as the size of third bits D3, the first bitmap and the second bitmap are re-set to the third bits, and the liquid drops are discharged in positions regulated by the third bitmap.

REFERENCES:
patent: 6156669 (2000-12-01), Knappenberger
patent: 6503831 (2003-01-01), Speakman
patent: 6531329 (2003-03-01), Asakura et al.
patent: 6566154 (2003-05-01), Yamamoto
patent: 6710843 (2004-03-01), Choo et al.
patent: 6713389 (2004-03-01), Speakman
patent: A 11-274671 (1999-10-01), None
patent: A 2000-216330 (2000-08-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing a device, device manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a device, device manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a device, device manufacturing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3408575