Semiconductor package and method of fabricating same

Details Semiconductor package and method of fabricating same Semiconductor package and method of fabricating same

2005-07-26

2005-07-26

Thai, Luan (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C438S614000, C257S780000, C257S774000, C257S738000

Reexamination Certificate

active

06921715

ABSTRACT:
A semiconductor package and a method of fabricating a semiconductor package are provided. The method of fabricating a semiconductor package provides a semiconductor die having a pad mounting surface and a plurality of bonding pads disposed on the pad mounting surface; attaches a medium on each of the bonding pads; arranges a spherical element on each of the bonding pads via the corresponding medium; forms an electroplating layer on each of the spherical elements and around the corresponding medium; and coats a protection layer on the pad mounting surface of the semiconductor die and the electroplating layers by means of a photoresist material. Furthermore, the protection layer is patterned and etched so as to expose the top portions of the electroplating layers.

REFERENCES:
patent: 5431328 (1995-07-01), Chang et al.
patent: 5977632 (1999-11-01), Beddingfield
patent: 6337445 (2002-01-01), Abbott et al.
patent: 6500693 (2002-12-01), Noguchi
patent: 6573458 (2003-06-01), Matsubara et al.
patent: 6756184 (2004-06-01), Peng et al.

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