Photolithography process with multiple exposures

Photocopying – Projection printing and copying cameras – Illumination systems or details

Reexamination Certificate

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Details

C355S053000, C355S067000

Reexamination Certificate

active

06839126

ABSTRACT:
A photolithography process with multiple exposures is provided. A photomask is placed and aligned above a wafer having a photoresist formed thereon at a predetermined distance. Multiple exposures are sequentially performed on the photoresist through the photomask. Each of the multiple exposures is provided with a respective illuminating setting that is optimized for one duty ratio of the photomask. Thereby, an optimum through-pitch performance for pattern transfer from the photomask unto the photoresist is obtained. Then, a development is performed on the photoresist.

REFERENCES:
patent: 5703675 (1997-12-01), Hirukawa et al.
patent: 20030103196 (2003-06-01), Hirukawa

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