Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-01-04
2005-01-04
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S132000, C438S215000, C438S281000, C257S529000
Reexamination Certificate
active
06838367
ABSTRACT:
An improved method for forming a fuse element is disclosed. During the formation of the upper capacitor plate in a capacitor structure, metals or their alloys are simultaneously patterned as an upper capacitor plate and as a fuse.
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Dickstein , Shapiro, Morin & Oshinsky, LLP
Malsawma Lex H.
Micro)n Technology, Inc.
Smith Matthew
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