Positive photosensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S281100, C430S286100, C430S905000, C430S907000, C430S910000

Reexamination Certificate

active

06846610

ABSTRACT:
Provided is a positive photosensitive resin composition comprising (A) a polymer which has alicyclic hydrocarbon skeleton and decomposes under the action of an acid to be rendered soluble in alkali, (B) a compound which generates an acid upon irradiation with actinic rays, (C) a nitrogen-containing basic compound, (D) at least one of a fluorine-containing surfactant and a silicon-containing surfactant and (E) a solvent. The composition can exhibit better characteristics when the solvent (E) is a combination of specified solvents.

REFERENCES:
patent: 5665518 (1997-09-01), Maeda et al.
patent: 5691111 (1997-11-01), Iwasa et al.
patent: 5707776 (1998-01-01), Kawabe et al.
patent: 5744281 (1998-04-01), Niki et al.
patent: 5756850 (1998-05-01), Iwasa et al.
patent: 5770346 (1998-06-01), Iwasa et al.
patent: 5824451 (1998-10-01), Aoai et al.
patent: 5939234 (1999-08-01), Yamanaka et al.
patent: 5945250 (1999-08-01), Aoai et al.
patent: 6060213 (2000-05-01), Kodama
patent: 6235445 (2001-05-01), Nakamura et al.
patent: 6265135 (2001-07-01), Kodama et al.
patent: 0 789 278 (1997-08-01), None
patent: 0 878 738 (1998-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Positive photosensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Positive photosensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Positive photosensitive resin composition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3400869

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.