Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2005-03-15
2005-03-15
Meier, Stephen D. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S737000, C257S738000, C257S778000, C257S780000, C257S787000, C257S788000, C257S789000, C257S795000
Reexamination Certificate
active
06867487
ABSTRACT:
A semiconductor package and a method for fabricating the same are proposed, wherein, in a molding process for encapsulating a semiconductor chip mounted on a substrate, a mold is used with a molding cavity formed with a plurality of recess portions relatively smaller in height, and with a plurality of air vents for connecting the recess portions to outside of the mold and for ventilate air in the molding cavity. This allows a molding resin used during molding to slow down its flow when flowing into the recess portions, as the molding resin rapidly absorbs heat transmitted from the mold and is increased in viscosity thereof. The slowed down molding resin can therefore be prevented from flashing out of the air vents, so that quality and appearance of the fabricated semiconductor package can be well assured.
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Ho Tzong-Da
Huang Chien-Ping
Corless Peter F.
Edwards & Angell LLP
Jensen Steven M.
Meier Stephen D.
Siliconware Precision Industries Co. Ltd.
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