Semiconductor memory devices using sidewall spacers

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S305000, C257S307000, C257S310000

Reexamination Certificate

active

06914286

ABSTRACT:
Storage nodes for semiconductor memory devices may be fabricated by repeatedly forming conductive and insulating spacers on mold oxide layer pattern sidewalls, to thereby obtain fine line patterns which can increase the surface area of the storage node electrodes. Supporters also may be provided that are configured to support at least one freestanding storage node electrode, to thereby reduce or prevent the storage node electrode from falling or bending towards an adjacent storage node electrode.

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Notice to Submit Response, KR Application No. 2002-0037059, Jul. 30, 2004.

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