Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1996-05-31
1998-01-27
King, Roy V.
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
427527, 437937, B05D 306
Patent
active
057119988
ABSTRACT:
A method of hydrogenating poly-Si in an electrical device including the step of placing a substrate having a poly-Si component in a radio frequency induced low pressure, high density plasma reactor. The method further includes the step of introducing into the radio frequency induced low pressure, high density plasma reactor a gas including at least hydrogen or deuterium. The hydrogenation of the poly-Si component is accomplished by striking a plasma in the radio frequency induced low pressure, high density plasma reactor under conditions that promote hydrogenation of the poly-Si component.
REFERENCES:
patent: 5314603 (1994-05-01), Sugiyama et al.
Peter Singer, "Trends in Plasma Sources: The Search Continues", Semiconductor International, Jul. 1992, pp. 5 -9.
Michael A. Lieberman and Allan J. Lichtenberg, Principles of Plasma Discharges and Materials Processing, 1994, Published by A Wiley-Interscience Publication, p. 388.
Nakazawa et al, Appl. Phys. Lett. 51(20) Nov. 1987, pp. 1623-1625.
King Roy V.
Lam Research Corporation
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