Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from gaseous state combined with preceding...
Reexamination Certificate
2005-03-29
2005-03-29
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
Fluid growth from gaseous state combined with preceding...
C438S239000, C438S514000, C438S647000, C438S649000, C438S651000, C438S653000, C257S068000, C257S071000, C257S382000, C257S768000
Reexamination Certificate
active
06872639
ABSTRACT:
An integrated circuit has a multi-layer stack such as a gate stack or a digit line stack disposed on a layer comprising silicon. A conductive film is formed on the transition metal boride layer. A process for fabricating such devices can include forming the conductive film using a vapor deposition process with a reaction gas comprising fluorine. In the case of a gate stack, the transition metal boride layer can help reduce or eliminate the diffusion of fluorine atoms from the conductive film into a gate dielectric layer. Similarly, in the case of digit line stacks as well as gate stacks, the transition metal boride layer can reduce the diffusion of silicon from the polysilicon layer into the conductive film to help maintain a low resistance for the conductive film.
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Al-Shareef Husam N.
DeBoer Scott J.
Dickstein , Shapiro, Morin & Oshinsky, LLP
Lee, Jr. Granvill David
Micro)n Technology, Inc.
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