Methods of making multi-tier laminate substrates for electronic

Details Methods of making multi-tier laminate substrates for electronic Methods of making multi-tier laminate substrates for electronic

1996-10-16

1998-08-25

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29830, 839291, 156150, 1562728, 174 524, 216 20, H01L 2312

Patent

active

057980144

ABSTRACT:
A method for making multi-tier laminate substrates for electronic device packaging is provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate.

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