Solder paste and terminal-to-terminal connection structure

Details Solder paste and terminal-to-terminal connection structure Solder paste and terminal-to-terminal connection structure

2005-03-15

2005-03-15

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S767000, C361S722000, C361S777000

Reexamination Certificate

active

06867378

ABSTRACT:
A solder paste contains a solder alloy powder and a metal powder dispersed in a flux. The solder alloy contains Sn and Zn, whereas the metal powder contains at least one element selected from the group consisting of Pd, Ti, and Ni. Preferably, the metal powder is contained in an amount exceeding the solubility limit of the metal powder with respect to the solder alloy at the melting point of the solder alloy powder. The solder paste may be used to form a structure for electrically connecting two objects by interposing a solder layer between their terminals.

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