Marking method for semiconductor wafer

Details Marking method for semiconductor wafer Marking method for semiconductor wafer

2005-04-12

2005-04-12

Le, Thien M. (Department: 2876)

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Reexamination Certificate

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06877668

ABSTRACT:
A plurality of minute ID marks are inscribed on a semiconductor wafer which is under manufacture, without imposing adverse effect to the wafer, in order to make the marks less susceptible to surface treatment to be performed during the course of manufacture. Further, the minute ID marks act as mutual backups. Inscribing such minute ID marks on a semiconductor wafer prevents confusion due to effacement of ultra-minute marks and eliminates worry about the impossibility of tracing a semiconductor wafer.

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patent: 2000-223380 (2000-08-01), None

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