Method for analyzing defect data and inspection apparatus...

Details Method for analyzing defect data and inspection apparatus... Method for analyzing defect data and inspection apparatus...

2005-04-05

2005-04-05

Rosenberger, Richard A. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C382S145000

Reexamination Certificate

active

06876445

ABSTRACT:
The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

REFERENCES:
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patent: 5943437 (1999-08-01), Sumie et al.
patent: 5982920 (1999-11-01), Tobin et al.
patent: 6317859 (2001-11-01), Papadopoulou
patent: A-6-61314 (1994-03-01), None
patent: A-10-214866 (1998-08-01), None
patent: 10-214866 (1998-08-01), None

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