Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-04-05
2005-04-05
Dang, Phuc T. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S698000, C257S787000
Reexamination Certificate
active
06876072
ABSTRACT:
A semiconductor chip assembly includes a semiconductor chip that includes first and second opposing major surfaces, wherein the first surface of the chip includes a conductive pad, a substrate that includes first and second opposing major surfaces, wherein the first and second surfaces of the substrate include a conductive terminal and a dielectric base, the conductive terminal extends through the dielectric base to the first and second surfaces of the substrate, a cavity extends from the first surface of the substrate into the substrate, the first surfaces of the chip and the substrate face in a first direction, the second surfaces of the chip and the substrate face in a second direction, and the chip extends into the cavity, a conductive trace in an electrically conductive path between the conductive terminal and the pad, and an adhesive disposed between the conductive trace and the chip, the conductive trace and the substrate, and the chip and the substrate.
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Lin Charles W. C.
Wang Chia-Chung
Bridge Semiconductor Corporation
Dang Phuc T.
Sigmond David M.
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