Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-02-02
1997-04-22
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29830, 839291, 156150, 1562728, 174 524, 216 20, H01L 2312, H01L 2352, H05K 346
Patent
active
056225881
ABSTRACT:
A method is disclosed for making multi-tier laminate substrates for electronic device packaging including providing a first laminating layer and a second laminating layer, each having a trace on a first side. These layers are laminated with a spacer layer and dielectric layers. A window is made in each of the spacer and the dielectric layers. After laminating the layers together, vias are formed. Then an opening is made in the first laminating layer that corresponds to the window openings in order to produce a cavity in the laminated structure for placing an electronic device therein.
REFERENCES:
patent: 3364087 (1968-01-01), Solomon et al.
patent: 3370203 (1968-02-01), Kravitz et al.
patent: 3972765 (1976-08-01), Kondo et al.
patent: 4101693 (1978-07-01), Tsen et al.
patent: 4115185 (1978-09-01), Carlson et al.
patent: 4211603 (1980-07-01), Reed
patent: 4338149 (1982-07-01), Quaschner
patent: 4446188 (1984-05-01), Patel et al.
patent: 4522667 (1985-06-01), Hanson et al.
patent: 4664962 (1987-05-01), DesMarais, Jr.
patent: 4677526 (1987-06-01), Muehling
patent: 4830554 (1989-05-01), Lopez
patent: 4908258 (1990-03-01), Hernandez
patent: 4931134 (1990-06-01), Hatkevitz et al.
patent: 4954200 (1990-09-01), Trewiler
patent: 4972253 (1990-11-01), Palino et al.
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5014418 (1991-05-01), Wright
patent: 5089878 (1992-02-01), Lee
patent: 5094969 (1992-03-01), Warren
patent: 5191511 (1993-03-01), Sawaya
patent: 5206188 (1993-04-01), Hiroi et al.
patent: 5256474 (1993-10-01), Johnston
Ron Iscoff; "Hestia Technologies Begins High Performance PQFP Deliveries"; Semiconductor International; Jun., 1990.
"HDP User Group/SEMI Packaging Array Workshop"; Cambridge, Mass.; Jun. 14, 1993.
Ball Michael W.
Hestia Technologies, Inc.
Lorin Francis J.
LandOfFree
Methods of making multi-tier laminate substrates for electronic does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of making multi-tier laminate substrates for electronic , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of making multi-tier laminate substrates for electronic will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-339015