Surface treatment method, surface-treated substrate, method...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S149000, C438S758000

Reexamination Certificate

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06861377

ABSTRACT:
The invention provides a surface treatment method by which a substrate with desired uniform lyophilicity is obtained in order to enhance the formation of a film pattern by an ink-jet process; a surface-treated substrate obtained by the surface treatment; and a method of forming a film pattern.A surface of a substrate is subjected to lyophobic treatment by forming a self-assembled layer composed of organic molecules. The lyophobicity is then modified by ultraviolet irradiation or the like to obtain desired lyophobicity.

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patent: 20040041753 (2004-03-01), Nakanishi
patent: A-59-75205 (1984-04-01), None
patent: A-2002-23356 (2002-01-01), None

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