Method of wafer edge damage inspection

Details Method of wafer edge damage inspection Method of wafer edge damage inspection

2005-03-15

2005-03-15

Williams, Hezron (Department: 2856)

Measuring and testing

Vibration

By mechanical waves

C073S599000, C073S602000, C250S559420, C356S237500

Reexamination Certificate

active

06865948

ABSTRACT:
A source of ultrasound waves or energy is directed at the wafer that is to be inspected in a direction that is essentially perpendicular with the surface of the wafer. The ultrasonic waves are intercepted and analyzed after these waves have passed through the wafer that is being inspected. From this analysis and comparing the captured waves or ultrasonic energy with the emitted ultrasonic waves, conclusions can be drawn on defects and other irregularities that are present in the medium, that is the wafer, through which the ultrasonic waves have passed.

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