Method of manufacturing semiconductor device including thin...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S486000

Reexamination Certificate

active

06890805

ABSTRACT:
When a crystalline semiconductor thin film formed by using a catalytic element for facilitating crystallization is subjected to a heat treatment in an atmosphere containing a halogen element at a temperature exceeding 700° C., a crystal structure in which crystal grain boundaries do not substantially exist can be obtained. In the present invention, the foregoing crystalline semiconductor thin film is formed on a crystallized glass substrate which is inexpensive and has high heat resistance, so that an inexpensive semiconductor device can be provided.

REFERENCES:
patent: 3484311 (1969-12-01), Benzing
patent: 4180618 (1979-12-01), Alpha et al.
patent: 4915772 (1990-04-01), Fehlner et al.
patent: 5412493 (1995-05-01), Kunii et al.
patent: 5422287 (1995-06-01), So
patent: 5583369 (1996-12-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5648277 (1997-07-01), Zhang et al.
patent: 5663077 (1997-09-01), Adachi et al.
patent: 5882960 (1999-03-01), Zhang et al.
patent: 5895933 (1999-04-01), Zhang et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 5923968 (1999-07-01), Yamazaki et al.
patent: 6107639 (2000-08-01), Yamazaki et al.
patent: 6291837 (2001-09-01), Nakajima et al.
patent: 6380011 (2002-04-01), Yamazaki et al.
patent: 6478263 (2002-11-01), Yamazaki et al.
patent: 6479333 (2002-11-01), Takano et al.
patent: 06-265940 (1994-09-01), None
patent: 08-078329 (1995-03-01), None
patent: 07-130652 (1995-05-01), None
patent: 07-135318 (1995-05-01), None
patent: 07-321339 (1995-12-01), None
patent: 08-139019 (1996-05-01), None
patent: 08-250744 (1996-09-01), None
Ohtani et al., “LP-B: Late-News Poster: A 60-in. HDTV Rear-Projector with Continuous-Grain Silicon Technology,” May 17-22, 1998, pp. 467-470, SID 98 Digest, International Symposium Digest of Technical Papers, vol. XXIX.
Ryuichi Shimokawa et al., “Characterization of High-Efficiency Cast-Si Solar Cell Wafers by MBIC Measurement,” May 1988, pp. 751-758, Japanese Journal of Applied Physics, vol. 27, No. 5.
Specifications and Drawings for U.S. Appl. No. 09/953,483, “Substrate of Semiconductor Device and Fabrication Method Thereof as well as Semiconductor Device and Fabrication Method Thereof”.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device including thin... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device including thin..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device including thin... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3385879

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.