Etching a substrate: processes – Gas phase etching of substrate – With measuring – testing – or inspecting
Reexamination Certificate
2005-01-04
2005-01-04
Vinh, Lan (Department: 1765)
Etching a substrate: processes
Gas phase etching of substrate
With measuring, testing, or inspecting
C216S060000, C216S066000, C438S007000, C438S706000
Reexamination Certificate
active
06838010
ABSTRACT:
In a system and a method for controlling critical dimensions of features to be formed on a substrate, a measurement device is coupled to an etch tool to form a feedback loop to control the critical dimensions on a wafer basis instead of a lot basis. In a further embodiment, the etch tool is in communication with a control unit that allows controlling of the etch tool and/or of the photolithography tool on the basis of an etch model. Thus, variations within a lot may be compensated by a software implementation of the etch model. The control unit may be implemented in the etch tool or an external device.
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Grasshoff Gunter
Hartig Carsten
Advanced Micro Devices , Inc.
Vinh Lan
Williams Morgan & Amerson P.C.
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