Packaging mold with electrostatic discharge protection

Details Packaging mold with electrostatic discharge protection Packaging mold with electrostatic discharge protection

2005-01-18

2005-01-18

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S629000, C257S774000, C257S680000, C257S668000, C257S787000, C257S355000, C257S362000

Reexamination Certificate

active

06844617

ABSTRACT:
The present invention relates to a packaging mold with electrostatic discharge protection, comprising at least one recess for receiving at least one packaging substrate, the packaging substrate comprising an outer wall with a first height, the recess comprising an inner wall with a second height and the inner wall electrically connecting the outer wall of the packaging substrate, wherein the second height is larger than the first height. When separating the packaging substrate and the packaging mold, the duration of the outer wall connecting to the inner wall is extended, so that static electric charges generated when separating are conducted via the packaging mold preventing the dice to be packaged from damage due to electrostatic discharge to raise the yield rate of semiconductor package products thereby.

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