Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2005-05-03
2005-05-03
Zarneke, David (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257S774000, C257S782000, C257S783000, C438S127000, C438S460000
Reexamination Certificate
active
06888230
ABSTRACT:
Semiconductor devices, semiconductor wafers, and semiconductor modules are provided, wherein: the semiconductor device has a small warp; damage at the chip edge and cracks occurring in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility. The semiconductor includes a semiconductor chip64; a porous stress relaxing layer3provided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layer2provided on the stress relaxing layer and connected to the electrodes; and external terminals10provided on the circuit layer; wherein an organic protecting film7is formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip6, and the protecting film7are exposed outside on the same plane.
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Anjoh Ichiro
Eguchi Shuji
Ishii Toshiaki
Kokaku Hiroyoshi
Nagai Akira
Antonelli Terry Stout & Kraus LLP
Mitchell James
Renesas Technology Corp.
Zarneke David
LandOfFree
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