Photo-curable resin composition, patterning process, and...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S325000, C430S927000, C427S510000, C522S099000, C522S148000

Reexamination Certificate

active

06899991

ABSTRACT:
A photo-curable resin composition comprising (A) an organosiloxane-bearing polymer comprising recurring units of formula (1):wherein R1to R4are monovalent C1-C8hydrocarbon, n is an integer of 1-1,000, and X isand having a Mw of 500-200,000, (B) a formalin-modified or formalin-alcohol-modified amino condensate, a phenol compound having on the average at least two methylol or alkoxymethylol radicals, or an epoxy compound having on the average at least two epoxy radicals, (C) a photoacid generator, and (D) a silicon compound of the formula: (R11)mSi(OR12)4−mwherein R11is monovalent C1-C9hydrocarbon, R12is C1-C4alkyl, m is 0-2, forms cured pattern films having dry etch resistance and improved adhesion to substrates.

REFERENCES:
patent: 6096479 (2000-08-01), Kawamura et al.
patent: 6436593 (2002-08-01), Minegishi et al.
patent: 6534235 (2003-03-01), Hanabata et al.
patent: 1186624 (2002-03-01), None
patent: 11-335464 (1999-12-01), None
English language machine translation of JP 11-335464.

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