Gimballed conditioning apparatus

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S443000, C451S056000

Reexamination Certificate

active

06949016

ABSTRACT:
A chemical mechanical planarization (CMP) conditioning apparatus is provided. The CMP conditioning apparatus is designed to connect to a positioning arm which is capable of applying the conditioning apparatus to a processing surface. Embodiments of the CMP conditioning apparatus include a housing configured to connect to the positioning arm, and one side of the housing having a concave gimbal surface. A puck holder that a convex gimbal surface configured to mate with the concave gimbal surface of the housing is further provided. Thee puck holder receives a conditioning puck that has an attach surface and an active surface. The concave gimbal surface and the convex gimbal surface define a projected gimbal point at about a plane defined at about the active surface of the conditioning puck.

REFERENCES:
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patent: 5941762 (1999-08-01), Ravkin et al.
patent: 6036583 (2000-03-01), Perlov et al.
patent: 6042457 (2000-03-01), Wilson et al.
patent: 6106379 (2000-08-01), Mosca
patent: 6234868 (2001-05-01), Easter et al.
patent: 6361423 (2002-03-01), Gurusamy et al.
patent: 6572440 (2003-06-01), Moore

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