Method for manufacturing a semiconductor device using laser...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C438S486000, C438S149000, C438S160000

Reexamination Certificate

active

06844249

ABSTRACT:
The invention relates to a method for manufacturing a semiconductor device, and it is an object of the invention to form a semiconductor area formed in island-like patterns as a single crystal or an area which can be regarded as a single crystal, and to simultaneously achieve a laminated structure by which various characteristics of TFTs can be stabilized, wherein an insulation film is formed on a glass substrate, and island-like semiconductor layer is formed thereon. A laser beam passed through a cylindrical lens is made into a linear laser beam and irradiated onto the island-like semiconductor layer by an optical system. The island-like semiconductor layer is subjected to two components, one of which is a direct laser beam component passing through the cylindrical lens and being irradiated directly onto the island-like semiconductor layer, and the other of which is a diffused laser beam component transmitting an insulation film and a substrate, being reflected by a reflection plate, and again transmitting the substrate and insulation film and being irradiated onto the island-like semiconductor laser.

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K. Shimizu, O. Sugiura, M. Matsumura, “High Mobility Poly-Si Thin Film Transistors Fabricated by a Novel Excimer Laser Crystallization Method”, IEEE Transactions on Electron Devices, vol., 40, No. 1, pp. 112-117, Jan., 1993.

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