Duel die package

Details Duel die package Duel die package

2005-03-08

2005-03-08

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S686000, C257S692000, C257S696000

Reexamination Certificate

active

06864566

ABSTRACT:
An improved dual die package is disclosed. The dual die package includes a first lead frame connected to a first semiconductor chip and a second lead frame connected to a second semiconductor chip. The first leads and the second leads are electrically connected to one another using a wirebonding process rather than a thermocompression process thereby allowing conventional packaging equipment to be used when manufacturing a dual die package.

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