Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2001-03-12
2004-08-17
Wilczewski, Mary (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000, C257S670000
Reexamination Certificate
active
06777786
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Background of the Invention
The present invention relates to a semiconductor device, and more particularly, to packaging techniques for semiconductor devices that include a package that can accommodate dual stacked dies.
2. Description of the Prior Art
Many of the applications for today's semiconductor devices require more and more power or capacity. However, today's applications also prefer semiconductor packages that are compact and thin. Finally, a concern in improving semiconductor devices includes maintaining very low package resistance (RDSon).
SUMMARY OF THE INVENTION
The present invention provides a semiconductor device that includes a leadframe that has a first source attach area on a first surface of the leadframe and a first gate attach area along with a second source attach area on a second surface of the leadframe and a second gate attach area. The device also includes two dies, a first of which is coupled to the first source and gate attach areas, while a second of which is coupled to the second source and gate attach areas. A drain connection assembly is coupled to a drain region of the first die and a body is coupled to the semiconductor device such that a drain region of the second die is exposed.
In accordance with one aspect of the present invention, the dies are bumped dies.
In accordance with another aspect of the present invention, the drain connection assembly includes a drain clip and a lead rail adjacent an edge of the drain clip.
The present invention also provides a method of making a semiconductor device.
Other features and advantages of the present invention will be understood upon reading and understanding the detailed description of the preferred exemplary embodiments found herein below, in conjunction with reference to the drawings, in which like numerals represent like elements.
REFERENCES:
patent: 4514750 (1985-04-01), Adams
patent: 4791473 (1988-12-01), Phy
patent: 5105536 (1992-04-01), Neugebauer et al.
patent: 5233131 (1993-08-01), Liang et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5512781 (1996-04-01), Inoue
patent: 5544412 (1996-08-01), Romero et al.
patent: 5763952 (1998-06-01), Lynch et al.
patent: 5789803 (1998-08-01), Kinsman
patent: 5986209 (1999-11-01), Tandy
patent: 6040626 (2000-03-01), Cheah et al.
patent: 6066515 (2000-05-01), Schoenfeld
patent: 6081031 (2000-06-01), Letterman, Jr. et al.
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6215176 (2001-04-01), Huang
patent: 6344687 (2002-02-01), Huang et al.
patent: 6373078 (2002-04-01), Yea
patent: 6399418 (2002-06-01), Glenn et al.
patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 6476474 (2002-11-01), Hung
patent: 2001/0048116 (2001-12-01), Standing et al.
patent: 2002/0071253 (2002-06-01), Lam et al.
patent: 2002/0086748 (2002-07-01), Pavier
patent: 2003/0025183 (2003-02-01), Thornton et al.
patent: 409116070 (1997-05-01), None
U.S. patent application Ser. No. 09/464,885, Joshi et al., Dec. 16, 1999.
“IR's New Synchronous Rectifier Chip Set Meets New Efficiency Standard for DC-DC Converters to Power Notebook PC Processors Through 2000,” International Rectifier Company Information. Retrieved from the World Wide Web at http://www.irf.com/whats-new
r990402.html on Jul. 29, 2003.
Fairchild Semiconductor Corporation
Lewis Monica
Townsend and Townsend / and Crew LLP
Wilczewski Mary
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