Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2003-05-29
2004-12-28
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S626000, C438S637000, C257S758000, C257S760000
Reexamination Certificate
active
06835648
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates to the improvement of the dielectric used in the poly-metal dielectric layer of a semiconductor device.
REFERENCES:
patent: 6165916 (2000-12-01), Muraoka et al.
patent: 6706635 (2004-03-01), Khan et al.
Hong Qi-Zhong
Huang Peter
Brady III W. James
Keagy Rose Alyssa
Picardat Kevin M.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
LandOfFree
Semiconductor PMD layer dielectric does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor PMD layer dielectric, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor PMD layer dielectric will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3317411