Semiconductor PMD layer dielectric

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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Details

C438S626000, C438S637000, C257S758000, C257S760000

Reexamination Certificate

active

06835648

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates to the improvement of the dielectric used in the poly-metal dielectric layer of a semiconductor device.


REFERENCES:
patent: 6165916 (2000-12-01), Muraoka et al.
patent: 6706635 (2004-03-01), Khan et al.

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