Method for forming dual damascene line structure

Details Method for forming dual damascene line structure Method for forming dual damascene line structure

2002-02-05

2004-06-01

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S638000, C438S618000, C438S622000, C438S624000, C438S672000

Reexamination Certificate

active

06743711

ABSTRACT:

The present invention claims the benefit of Korean Patent Application No. P2001-36970 filed in Korea on Jun. 27, 2001, which is hereby incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method for forming a semiconductor device, and more particularly, to a method for forming a dual damascene line structure to obtain a fine pattern and to minimize polymer production.
2. Background of the Related Art
A related art method for forming a dual damascene line structure will now be explained with reference to the accompanying drawings.
FIGS. 1A
to D are cross-sectional views illustrating process steps of a related art method for forming a dual damascene line structure, and
FIGS. 2A
to D are cross-sectional views illustrating another related art method for forming a dual damascene line structure.
A method for forming a via hole after forming a trench and a method for forming a trench after forming a via hole have been suggested as typical methods.
As shown in
FIG. 1A
, the related art method for forming a dual damascene line structure includes forming a trench for forming a lower metallic line within an insulating layer
2
on a semiconductor substrate
1
, and then burying a metallic layer inside the trench to form a lower metallic line
3
.
Subsequently, a diffusion barrier layer
4
is formed on the lower metallic line
3
. Then, a low inter-metal dielectric IMD material is deposited on the diffusion barrier layer
4
to form an inter-metal dielectric IMD
5
.
Additionally, after depositing a photoresist on the IMD
5
, a photoresist pattern
6
having a via hole pattern is formed by exposure and developing processes so that a portion of the IMD
5
is exposed.
In this case, the photoresist pattern
6
is formed thick enough for forming a deep via hole in a later process. Alternatively, the photoresist pattern
6
is formed to have a higher etch selectivity than that of the IMD
5
.
Using the photoresist pattern
6
as a mask, the IMD
5
is etched by a plasma dry etching process to form a via hole therein.
As shown in
FIG. 1B
, after removing the photoresist pattern
6
, a polymer remaining within the via hole is removed by a cleaning process.
In addition, as shown in
FIG. 1C
, after depositing a photoresist on the IMD
5
, the IMD
5
is negatively patterned to expose a portion of the IMD
5
, thereby forming a photoresist pattern
6
a
having a trench pattern.
Subsequently, as shown in
FIG. 1D
, using the photoresist pattern
6
a
as a mask, the IMD
5
is selectively etched to form a trench.
In this case, a micro-trench shown as portion ‘A’ is formed inside the trench during the etching process.
Additionally, after depositing a metallic material such as tungsten, which is thick enough to completely bury the via hole and the trench, the metallic material is planarized by a chemical mechanical polishing (CMP) process. Thus, an upper surface of the IMD
5
is exposed, thereby forming a plug (not shown) and an upper metallic line (not shown).
The process of the aforementioned related art method for forming a dual damascene line structure is simple and has an advantage of preventing an increase in a dielectric constant of the IMD
5
through the diffusion barrier layer
4
. However, the aforementioned method has a disadvantage in that, in order to form a deep via hole, the photoresist pattern
6
should be thick enough or the IMD
5
should have a higher etch selectivity than that of the photoresist pattern.
In addition, removing the polymer that remains within the via hole is difficult, and a micro-trench may be formed in etching the trench.
In
FIG. 2A
, another related art method of forming a dual damascene line structure includes sequentially depositing a diffusion barrier layer
24
, a first IMD
25
, an etching stop layer
26
, and a second IMD
27
on a semiconductor substrate
21
including a lower metallic line
23
formed within an insulating layer
22
.
Then, after depositing a photoresist on the second IMD
27
, a photoresist pattern
28
having a trench pattern is formed by exposure and development processes, thereby exposing a portion of the second IMD
27
.
As shown in
FIG. 2B
, using the photoresist pattern
28
as a mask, the second IMD
27
is etched by a plasma dry etching process exposing a portion of the etching stop layer
26
so as to form a trench.
In addition, as shown in
FIG. 2C
, the photoresist pattern
28
having a trench pattern is removed. A photoresist is once again deposited on the entire surface. The photoresist is then patterned by a negative patterning process to expose a portion of the etching stop layer
26
so as to form a photoresist pattern
28
a
having a via hole pattern.
Subsequently, as shown in
FIG. 2D
, using the photoresist pattern
28
a
as a mask, the etching stop layer
26
, the first IMD
25
, and the diffusion barrier layer
24
are selectively etched exposing a portion of a lower metallic line so as to form a via hole.
Then, after depositing a metallic material such as tungsten, which is thick enough to completely bury the via hole and the trench, the metallic material is planarized by a CMP process exposing an upper surface of the second IMD
27
to form a plug (not shown) and an upper metallic line (not shown).
The related art process of the aforementioned method for forming a dual damascene line structure has an advantage of controlling the depth and profile of etching during the trench etching and the via hole etching processes. However, the aforementioned method has a difficulty in controlling the width of the via hole when forming the photoresist pattern for a via hole etching process and an increase in dielectric constant of the IMD due to the etching stop layer.
As discussed above, the two related art methods for forming a dual damascene line structure have the following problems. When etching a via hole and a trench, by using a photoresist pattern as a mask, it is difficult to form a fine pattern due to the thickness of the photoresist pattern.
This not only results in a difficulty in accurately controlling the size of the trench or the via hole, but also results in a plurality of polymers produced during the etching process of IMDs.
SUMMARY OF THE INVENTION
Accordingly, the present invention is directed to a method for forming a dual damascene line structure that substantially obviates one or more problems due to limitations and disadvantages of the related art.
An object of the present invention is to provide a method for forming a dual damascene line structure capable of forming a fine pattern and minimizing polymer produced during the process, by using a hard mask having a double pattern of a via hole and a trench.
Additional features and of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, a method for forming a dual damascene line structure includes forming an inter-metal dielectric including a first region and a second region on a semiconductor substrate, forming a first hard mask material layer on an entire surface of the inter-metal dielectric, removing the first hard mask material layer on the first region, forming a second hard mask material layer on an entire surface of the inter-metal dielectric, forming a hard mask to remove a portion of the first hard mask material layer on the second region, etching the inter-metal dielectric of the first region to a first thickness using the hard mask, exposing the inter-metal dielectric of the second region, and etching the exposed inter-metal dielectric to simultaneously form a via hole and a trench having the via hole.
In another aspect, a method for

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