Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-11-20
1991-04-02
Schor, Kenneth M.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 1566591, 156637, C23F 100
Patent
active
050045210
ABSTRACT:
A process of shaping a thin metal film into a lead frame starts with preparing a thin metal film, an etchant effective against the thin metal film and a photoresist solution resistive to the etchant, followed by coating the entire surface of the thin metal film with the photoresist solution so as to form a multiple level structure having the thin metal film and a photoresist film, and a predetermined pattern is embossed on the multiple level structure so as to break slits in the photoresist film along the periphery of the predetermined pattern, then removing a part of the multiple level structure by using the etchant so that a hollow space is formed therein in the predetermined pattern.
REFERENCES:
patent: 3563819 (1971-02-01), Rheingold et al.
patent: 3719536 (1973-03-01), Rheingold et al.
patent: 3923566 (1975-12-01), Law
patent: 4023998 (1977-05-01), Cederberg et al.
patent: 4563238 (1986-01-01), Rhoades
patent: 4600470 (1986-07-01), Maynard et al.
patent: 4704187 (1987-11-01), Fujita
Bruckner John J.
Schor Kenneth M.
Yamaha Corporation
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