Resin molding apparatus for sealing an electronic device

Details Resin molding apparatus for sealing an electronic device Resin molding apparatus for sealing an electronic device

1994-07-08

1996-04-16

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

4251291, 425544, 425546, 425420, 425812, B29C 4502, B29C 4514, B29C 4534

Patent

active

055076335

ABSTRACT:
In an apparatus for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.

REFERENCES:
patent: 4793785 (1988-12-01), Osada
patent: 4874308 (1989-10-01), Atlas et al.
patent: 4915607 (1990-04-01), Medders et al.
patent: 5059112 (1991-10-01), Wieser
patent: 5059373 (1991-10-01), Hirabayashi
patent: 5082615 (1992-01-01), Sakai
patent: 5108278 (1992-04-01), Tsutsumi et al.

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