Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2003-01-09
2004-05-25
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S684000, C257S778000, C257S432000
Reexamination Certificate
active
06740973
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a stacked structure for an image sensor, and more particularly to a stacked structure in which a photosensitive chip and integrated circuits with different functions may be integrally packaged.
2. Description of the Related Art
A general sensor is used for sensing signals that may be image signals or audio signals. The sensor of the invention is used to receive image (optical) signals and convert the image signals into electrical signals that are to be transmitted to the printed circuit board.
The image sensor is further electrically connected to other packaged integrated circuits in order to possess various functions. For example, the image sensor may be electrically connected to a digital signal processor which is used to process the signals generated by the image sensor. Furthermore, the image sensor may be electrically connected to a micro controller or a central processing unit to possess various functions.
However, a conventional image sensor is individually packaged. Thus, various integrated circuits mating with the image sensor have to be individually packaged with the image sensor. The packaged image sensor and various signal processing units are then electrically connected to the printed circuit board via a plurality of wires. In this structure, a substrate and a package body have to be used when each of the signal processing units and the image sensor are individually packaged, thereby increasing the manufacturing costs. Furthermore, when each of the signal processing units is mounted to the printed circuit board, the required area of the printed circuit board is relatively large. Thus, the products cannot be made thin, small, and light.
Referring to
FIG. 1
, a conventional stacked structure for an image sensor includes a substrate
10
having a first surface
12
and a second surface
14
. Signal input terminals
15
are formed on the first surface
12
, and signal output terminals
16
, which are to be electrically connected to a printed circuit board
17
, are formed on the second surface
14
. The image sensor also includes a frame layer
18
, a photosensitive chip
26
, a plurality of wires
28
, a transparent layer
34
, and an integrated circuit
19
. The frame layer
18
has an upper surface
20
and a lower surface
22
, which is adhered to the first surface
12
of the substrate
10
to form a cavity
24
together with the substrate
10
. The photosensitive chip
26
is placed within the cavity
24
formed by the substrate
10
and the frame layer
18
, and is mounted to the first surface
12
of the substrate
10
. Each of the wires
28
has a first terminal
30
electrically connected to the photosensitive chip
26
, and a second terminal
32
electrically connected to a corresponding signal input terminal
15
of the substrate
10
. The transparent layer
34
is placed on the upper surface
20
of the frame layer
18
. The integrated circuit
19
is mounted to the second surface
14
of the substrate
10
.
According to the above-mentioned structure, the overall volume of the image sensor is large, and the image sensor cannot be miniaturized.
SUMMARY OF THE INVENTION
It is therefore an object of the invention to provide a stacked structure for an image sensor, in which the number of package members may be decreased and the package cost may be lowered.
Another object of the invention is to provide a stacked structure for an image sensor, which is capable of simplifying and facilitating the manufacturing processes.
Still another object of the invention is to provide a stacked structure for an image sensor, in which the area of the image sensor may be reduced.
Yet still another object of the invention is to provide a stacked structure for an image sensor, which can be miniaturized and made more practical in use.
To achieve the above-mentioned objects, the invention provides an image sensor, which is to be electrically connected to a printed circuit board. The image sensor includes a transparent glass layer on which a plurality of signal input terminals and signal output terminals are formed, a photosensitive chip on which a plurality of bonding pads is formed, a substrate, and an integrated circuit. Each of the bonding pads is formed with a projection, and the photosensitive chip is electrically connected to the signal input terminals on the transparent glass layer through the projections. The substrate has a first surface, a second surface, and a first through hole penetrating through the substrate from the first surface to the second surface. The signal output terminals of the transparent glass layer are electrically connected to the first surface of the substrate with the photosensitive chip positioned within the first through hole of the substrate. The second surface is electrically connected to the printed circuit board. The integrated circuit is electrically connected to the second surface of the substrate.
According to above-mentioned structure, the above-mentioned objects can be achieved.
REFERENCES:
patent: 5211762 (1993-05-01), Isoda et al.
patent: 5952714 (1999-09-01), Sano et al.
patent: 6130448 (2000-10-01), Bauer et al.
patent: 6297540 (2001-10-01), Assadi et al.
patent: 6396116 (2002-05-01), Kelly et al.
patent: 6455774 (2002-09-01), Webster
patent: 6531341 (2003-03-01), Peterson et al.
patent: 6545332 (2003-04-01), Huang
patent: 6590269 (2003-07-01), Chuang et al.
patent: 2002/0096753 (2002-07-01), Tu et al.
patent: WO 02/075815 (2002-09-01), None
patent: 2-126685 (1990-05-01), None
Clark Jasmine
Kingpak Technology Inc.
Pro-Techtor Inter-national Services
LandOfFree
Stacked structure for an image sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked structure for an image sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked structure for an image sensor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3202124