Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2002-07-31
2003-11-25
Dang, Trung (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S020000, C438S034000, C438S623000, C438S780000, C148SDIG001
Reexamination Certificate
active
06653232
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method of manufacturing a member pattern, wiring, circuit substrate, electron source, and image-forming apparatus using photosensitive paste.
2. Related Background Art
Two kinds of electron-emitting devices, hot electron sources and cold cathode electron sources, have been known as electron-emitting devices applied as electron sources of image-forming apparatus and the like. Examples of the cold cathode electron source include a field emission device (FE device), a metal-insulating layer-metal device (MIM device), and a surface conduction electron-emitting device.
The structure of the surface conduction electron-emitting device is shown in
FIGS. 12A and 12B
.
FIG. 12A
is a schematic plan view of the surface conduction electron-emitting device and
FIG. 12B
is a schematic sectional view taken along the line
12
B—
12
B in FIG.
12
A. In
FIGS. 12A and 12B
,
11
denotes an insulating substrate,
7
, an electron-emitting conductive film,
2
and
3
, electrodes, and
8
, an electron-emitting region.
FIG. 13
is a rough structural diagram showing an example of image-forming apparatus that uses an electron-emitting device such as the surface conduction electron-emitting device shown in
FIGS. 12A and 12B
. In
FIG. 13
,
81
denotes a substrate,
82
, an outer frame, and
86
, a face plate where an image-forming member
84
is arranged. An envelope (airtight container)
88
is provided for seal-bonding of joints of the outer frame
82
, substrate
81
, and face plate
86
with an adhesive such as low melting point glass frit, which is not shown in the drawing. The interior of the image-forming apparatus is thus kept vacuum by the envelope
88
.
A substrate
11
is fixed to the substrate
81
. On the substrate
11
, n×m electron-emitting devices denoted by
74
are arranged (n and m are each a positive integer equal to or larger than 2, and are set appropriately in accordance with the objective display pixel number).
The electron-emitting devices
74
are connected to wiring
4
and
6
. The wiring in
FIG. 13
is composed of m lines of row-directional wiring
4
and n lines of column-directional wiring
6
(also called matrix wiring). The row-directional wiring
4
and the column-directional wiring
6
are insulated from each other by placing not-shown insulating layers at intersections between the row-directional wiring
4
and the column-directional wiring
6
.
In order to manufacture the above image-forming apparatus, a large number of row-directional wiring
4
and column-directional wiring
6
are required.
A method of forming a large number of row-directional wiring
4
and column-directional wiring
6
is disclosed in Japanese Patent Application Laid-Open No. 08-34110 in which the wiring are formed using a printing technique that can handle a large area at a relatively low cost without needing vacuum apparatus or the like.
To enhance the definition of image-forming apparatus as the one described above, wiring for feeding current to electron-emitting devices to drive the electron-emitting devices has to be formed even more precisely.
A method using photosensitive paste can be considered as a way to form the above wiring with high precision. Japanese Patent Application Laid-Open No. 2000-251682 discloses formation of wiring using photosensitive paste.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a method of manufacturing a member pattern such as wiring which can reduce an edge curl, and a method of manufacturing a wiring, a circuit substrate, an electron source and an image forming apparatus incorporating the above method of manufacturing the member pattern. In order to achieve the above-mentioned object, a method of manufacturing wiring according to the present invention includes: a step of forming a conductive layer pattern through a developing step after performing film formation and exposure step once or several times using photosensitive paste that contains a photosensitive material and a conductive material; a step of forming an insulating layer pattern on at least a part of the conductive pattern through a developing step after performing film formation and exposure step once or several times using photosensitive paste that contains a photosensitive material and an insulating material; and a baking step for baking the conductive layer pattern and the insulating layer pattern. Further, according to another aspect of the present invention, there is provided a method of manufacturing a member pattern with a first member patterned on a substrate and a second member patterned over the first member to the substrate, the method including: a step of applying first photosensitive paste to the top face of the substrate; a step of forming a precursor pattern of the first member by exposing and developing the first photosensitive paste; a step of applying second photosensitive paste over the top face of the precursor pattern of the first member to the top face of the substrate; a step of forming a precursor pattern of the second member by exposing and developing the second photosensitive paste; and a step of baking the precursor patterns of the first and second members.
REFERENCES:
patent: 5839363 (1998-11-01), Yanagisawa et al.
patent: 6030707 (2000-02-01), Katoh et al.
patent: 6213834 (2001-04-01), Ohnishi et al.
patent: 6399282 (2002-06-01), Kubota et al.
patent: 6426588 (2002-07-01), Yanagisawa
patent: 2002/0095785 (2002-07-01), Kubo et al.
patent: 8-34110 (1996-02-01), None
patent: P2000-251682 (2000-09-01), None
Ishiwata Kazuya
Uda Yoshimi
Canon Kabushiki Kaisha
Dang Trung
Fitzpatrick ,Cella, Harper & Scinto
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