Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-03-27
1996-01-16
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257713, 257787, 257796, 257659, 257660, 361688, 361702, 361704, H01L 2302, H01L 3902, H02B 100, H02K 500
Patent
active
054850371
ABSTRACT:
An inexpensive packaged integrated circuit with improved heat dissipative capacity and electrical performance. In one embodiment, the packaged integrated circuit includes a semiconductor die, a plurality of electrically conductive package leads, a thermal induction plate and a plurality of electrically conductive bond wires. A surface of the thermal induction plate may remain exposed outside the package. The thermal induction plate reduces package lead inductance and provides shielding of electromagnetic radiation that can cause electromagnetic interference. Preferably, holes are formed through the thermal induction plate to enhance flow of the package material during formation of a package and provide interlocking of the package to the remainder of the integrated circuit. In another embodiment, the packaged integrated circuit further includes a heat sink having a surface exposed to the exterior of the package. The heat sink may also perform an electrical function such as, for instance, acting as a power or ground plane. One or more generally conductive layers can be added to either of the above embodiments. The generally conductive layer or layers may be used to provide ground planes, power planes and/or electrically conductive traces for signal routing or an interconnect ring. The generally conductive layer or layers enable uniform power and ground supplies to be provided to the circuitry formed on the die, reduce package lead inductance, provide decoupling capacitances that reduce switching noise and crosstalk, and allow increased flexibility in the placement of particular circuit components.
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Amkor Electronics, Inc.
Jackson Jerome
Jr. Carl Whitehead
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