Method of sealing electronic component with molded resin

Details Method of sealing electronic component with molded resin Method of sealing electronic component with molded resin

1997-03-06

1999-02-23

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438127, 26427217, H01L 2144

Patent

active

058743243

ABSTRACT:
A method of sealing an electronic component with molded resin comprises an electronic component setting step of engaging an electronic component mounted on a lead frame in mold cavities which are provided on mold surfaces of a fixed mold section and a movable mold section respectively to be opposed to each other, and a resin sealing step of charging a heated/melted resin material in the mold cavities engaged with the electronic component and sealing the electronic component received in the mold cavities and the lead frame around the same in a resin mold package corresponding to the shapes of the mold cavities. The resin sealing step is carried out by applying a prescribed resin pressure to the resin charged in the mold cavities and thereafter pressing the resin received in the mold cavities against the lead frame from the exterior.
According to this method, adhesion between the resin mold package molded in the mold cavities and the lead frame is improved, whereby these members are prevented from defining a clearance therebetween and water is prevented from infiltrating from therebetween, and the quality and the reliability of the product can be improved.

REFERENCES:
patent: 4888307 (1989-12-01), Spairisano et al.
patent: 5447888 (1995-09-01), Takashima et al.
patent: 5674343 (1997-10-01), Hotta et al.
patent: 5753538 (1998-05-01), Kuno et al.

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