Electronic digital logic circuitry – Signal sensitivity or transmission integrity
Reexamination Certificate
2001-11-30
2003-09-30
Chang, Daniel (Department: 2819)
Electronic digital logic circuitry
Signal sensitivity or transmission integrity
C326S026000, C326S082000
Reexamination Certificate
active
06628138
ABSTRACT:
BACKGROUND OF INVENTION
A typical computer system has at least a microprocessor and memory. The microprocessor processes, i.e., executes, instructions to accomplish various tasks the computer system. Such instructions, along with the data required by the microprocessor when executing these instructions, are stored in some form of memory.
FIG. 1
shows a typical computer system having a microprocessor
10
and some form of memory
20
. The microprocessor
10
has, among other components, a central processing unit (also known and referred to as “CPU” or “execution unit”)
12
and a memory controller (also known as “load/store unit”)
14
. The CPU
12
is where the actual arithmetic and logical operations of the computer system take place. To facilitate the execution of operations by the CPU
12
, the memory controller
14
provides the CPU
12
with necessary instructions and data from the memory
20
. The memory controller
14
also stores information generated by the CPU
12
into the memory
20
.
The operations that occur in a computer system, such as the logical operations in the CPU and the transfer of data between the CPU and memory, require power. If the components responsible for carrying out specific operations do not receive adequate power in a timely manner, computer system performance is susceptible to degradation. As an added challenge, power consumption of modern computers has increased as a consequence of increased operating frequencies. Thus, providing power to the components in a computer system in a sufficient and timely manner has become an issue of significant importance.
Often, power supplied to a computer system component varies, which, in turn, affects the integrity of the component's output. Typically, this power variation results from the distance between a power supply for the component and the component itself. This distance may lead to the component not receiving power (via current) at the exact time it is required. One approach used by designers to combat this performance-inhibiting behavior is introducing decoupling capacitance (also referred to as “decap”) to a particular circuit by positioning one or more decoupling capacitors close to the component. These decoupling capacitors store charge from the power supply and distribute the charge to the component when needed. For example, if power received by a component from a power supply attenuates, one or more decoupling capacitors will distribute charge to the component to ensure that the component is not affected by the power variation on the power supply. In essence, a decoupling capacitor acts as a local power supply for one or more specific components in a computer system.
Within a computer system component, such as a circuit, there are two types of decoupling capacitance: implicit and explicit. Explicit decoupling capacitance is provided to the circuit through the use of decoupling capacitors as discussed above. Implicit decoupling capacitance (also known in the art as “parasitic capacitance” or “inherent capacitance”) is capacitance that is inherent in a circuit. Implicit decoupling capacitance results from the electromagnetic effects between current-carrying wires. Further, implicit decoupling capacitance is a function of the distance between two such wires. Also, the ability to help supplement an attenuating voltage using explicit decoupling capacitors or implicit decoupling capacitance is a function of the potential applied to the decaps.
FIG. 2
shows the presence of explicit and implicit decoupling capacitance in a section of a typical computer system component
40
. The component
40
has a power supply bus
44
and a ground bus
46
that provides power through a connection to a power supply
42
. The power supply
42
may be a part of component
40
or a separate element. Power from the power supply
42
is made available to multiple power supply lines
48
and
52
via connections to the power supply bus
44
and to multiple ground lines
50
and
54
via connections to the ground bus
46
. Power from the power supply
42
is delivered to chip logic circuits
60
and
68
via the power supply lines
48
and
52
, respectively, and ground lines
50
and
54
, respectively. When there is power variation across the power supply
42
, explicit decoupling capacitors
56
,
57
,
58
, and
59
positioned in parallel with the power supply
42
provide charge, i.e., power, to the chip logic circuits
60
and
68
.
Still referring to
FIG. 2
, the existence of implicit decoupling capacitances
64
,
66
,
72
, and
74
is shown. A first occurrence of implicit decoupling capacitance
64
occurs between the power supply line
48
and a signal line
62
from the chip logic circuit
60
. A second occurrence of implicit decoupling capacitance
66
occurs between the signal line
62
and the ground line
50
. The implicit decoupling capacitances
64
and
66
are dependent on the characteristics of the signal line
62
, specifically, whether a signal on the signal line
62
is high or low. When the signal is low, the implicit decoupling capacitance provided to the chip logic circuit
60
is equal to the implicit decoupling capacitance
64
between the power supply line
48
and the signal line
62
. Alternatively, when the signal is high, the implicit decoupling capacitance provided to the chip logic circuit
60
is equal to the implicit decoupling capacitance
66
between the signal line
62
and the ground line
50
.
Still referring to
FIG. 2
, implicit decoupling capacitance is also present in a substantial number of additional circuits. For example, another first occurrence of implicit decoupling capacitance
72
occurs between the power supply line
52
and a signal line
70
from the chip logic circuit
68
. Another second occurrence of implicit decoupling capacitance
74
occurs between the signal line
70
and the ground line
54
. The implicit decoupling capacitances
72
and
74
are dependent on the characteristics of the signal line
70
, specifically, whether a signal on the signal line
70
is high or low. When the signal is low, the implicit decoupling capacitance provided to the chip logic circuit
68
is equal to the implicit decoupling capacitance
72
between the power supply line
52
and the signal line
70
. Alternatively, when the signal is high, the implicit decoupling capacitance provided to the chip logic circuit
68
is equal to the implicit decoupling capacitance
74
between the signal line
70
and the ground line
54
.
SUMMARY OF INVENTION
According to one aspect of the present invention, an integrated circuit comprises a signal path having a value switchable between a first potential and a second potential; and a first shield disposed to provide shielding to the signal path, where the first shield is assigned a third potential dependent on a probability of the value being at the first potential versus the second potential.
According to another aspect of the present invention, a method for preferentially shielding a signal having a value switchable between a first potential and a second potential comprises determining a probability of the value being at the first potential versus the second potential, and assigning a third potential to a first shield associated with the signal, where the third potential applied to the shield is assigned based on the probability.
According to another aspect of the present invention, an integrated circuit, comprises a signal path having a value switchable between a first potential and a second potential; and means for preferentially shielding the signal path depending on a probability of the signal being at the first potential versus the second potential.
Other aspects and advantages of the invention will be apparent from the following description and the appended claims.
REFERENCES:
patent: 5027321 (1991-06-01), Park
patent: 5436573 (1995-07-01), Ogawa et al.
patent: 6184702 (2001-02-01), Takahashi et al.
patent: 6229095 (2001-05-01), Kobayashi
patent: 6285208 (2001-09-01), Ohkubo
patent: 0575892 (1993-12-01), None
Bobba Sudhakar
Thorp Tyler
Chang Daniel
Rosenthal & Osha L.L.P.
Sun Microsystems Inc.
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