Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2002-01-03
2002-12-03
Clark, Jasmine J B (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
Reexamination Certificate
active
06489685
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a component built-in module in which an electronic component such as a semiconductor and/or a circuit component is provided inside an electric insulation layer, and to a method for manufacturing the same.
2. Related Background Art
Recently, following the tendency of electronic devices toward high performance and compact size, it is increasingly demanded to achieve high density and improved function of circuit components. It also is demanded to provide a circuit-component-mounted module suitable for high density and improved performance. To mount circuit components at a higher density, wiring patterns are complicated increasingly, and hence, there is a tendency of wiring boards toward multi-lamination.
In the case of conventional glass-epoxy substrates, multi-lamination is achieved with a through hole structure that is obtained by drilling. This structure has high reliability, but wiring patterns provided thereon are limited since wiring patterns in different layers are connected using through holes. Furthermore, a semiconductor or a circuit component cannot be mounted at an area on a surface of the wiring board where the through hole is provided, and therefore, it is not suitable for high-density component-mounting.
Therefore, as a method for achieving high densification of circuitry, a multi-layer wiring board utilizing electric connection by inner vias is used also. The inner via connection allows the wiring patterns between large scale integrated circuits (LSIs) and components to be connected over the shortest distances, and also provides only necessary connections between wiring pattern layers, thereby facilitating the circuit component mounting. Furthermore, by incorporating circuit components in a wiring board, the component mounting efficiency is improved further.
However, the incorporation of circuit components and the connection of the same through inner vias may have a problem in reliability. The reliability of the inner via connection is influenced significantly by the ratio of a height of an inner via to a diameter thereof (i.e., aspect ratio=height/diameter). In the case where a circuit component is incorporated in a wiring board, an electric insulation layer having a height greater than a height of the circuit component is required, thereby necessarily causing an inner via to have a greater height. Therefore, to improve the connection reliability, it is necessary to increase the diameter of an inner via. However, an increase in the diameter leads to a decrease in the mounting density.
SUMMARY OF THE INVENTION
Therefore, it is an object of the present invention to provide a component built-in module that has high reliability and is suitable for high-density component-mounting, and a method for manufacturing the same.
A first component built-in module of the present invention includes: an electric insulation layer; first wiring patterns in a plurality of layers that are laminated with the electric insulation layer being interposed therebetween; at least one first inner via electrically connecting the first wiring patterns in different layers with each other; and at least one electronic component that is embedded in the electric insulation layer and is mounted on any one of the first wiring patterns in the plurality of layers. Herein, at least one of the first inner vias is present in a range that overlaps a range in which the electronic component is present in a lamination direction in which the first wiring patterns are laminated, and has a height in the lamination direction that is smaller than a height of the electronic component.
Here, in the present invention, “height of an electronic component” means a distance from an upper surface of a wiring pattern on which the electronic component is mounted to an upper surface of the electronic component. More preferably, it means a thickness of the electronic component itself. Furthermore, the term “overlap” herein means that the two concerned ranges overlap each other at least partly, and the ranges do not necessarily coincide with each other completely.
This configuration makes it possible to suppress a height of the first inner via provided substantially opposite to the electronic component in a direction perpendicular to the lamination direction of the first wiring patterns. As a result, even with a decreased diameter of the via, the degradation of reliability resulting from an increase in the aspect ratio is prevented. Therefore, it is possible to provide a component built-in module that has high reliability and is suitable for high-density component-mounting.
The first component built-in module preferably further includes a wiring board including second wiring patterns in at least two layers, and a through hole and/or a second inner via that electrically connects the second wiring patterns in different layers with each other. Here, the wiring board is embedded inside the electric insulation layer, and any one of the first wiring patterns in the plurality of layers and the second wiring pattern are connected electrically through an inner via.
This configuration makes it possible to provide a component built-in module suitable for high-density component-mounting, taking advantage of the high reliability of the wiring board. Further, since a generally used wiring board can be used, this leads to a decrease in production cost.
Next, a second component built-in module of the present invention includes: an electric insulation layer; first wiring patterns in a plurality of layers that are laminated with the electric insulation layer being interposed therebetween; at least one first inner via electrically connecting the first wiring patterns in different layers with each other; a wiring board including second wiring patterns in at least two layers, and a through hole and/or a second inner via that electrically connects the second wiring patterns in different layers with each other; and at least one electronic component that is embedded in the electric insulation layer and is mounted on any one of the second wiring patterns. Here, at least one of the first inner vias is present in a range that overlaps a range in which the electronic component is present in a lamination direction in which the first wiring patterns are laminated, and has a height in the lamination direction that is smaller than a height of the electronic component.
In a component built-in module that utilizes an existing element having an electronic component mounted on a wiring board, and has an electric insulation layer laminated on the electronic component-mounted surface, it is possible to decrease a height of the first inner via provided substantially opposite to the electronic component in a direction perpendicular to the lamination direction of the first wiring pattern. As a result, even with a decreased diameter of the via, the degradation of reliability resulting from an increase in the aspect ratio is prevented. Therefore, it is possible to provide a component built-in module that has high reliability and is suitable for high-density component-mounting.
Each of the first and second component built-in modules preferably further includes at least one electronic component that is mounted on any one of the first wiring patterns in the plurality of layers, and is not embedded in the electric insulation layer. This provides a component built-in module that has high reliability and is suitable for mounting components at a further higher density.
Furthermore, in each of the first and second component built-in modules, the electric insulation layer preferably is made of a mixture of a filler and an insulating resin. By selecting a type of a filler, it is possible to control a heat conductivity, a coefficient of linear expansion, a dielectric constant, etc. of the electric insulation layer.
In this case, the filler preferably contains at least one selected from alumina, magnesia, boron nitride, aluminum nitride, silicon nitride, tetrafluoroethylene, and silica. T
Asahi Toshiyuki
Komatsu Shingo
Nakatani Seiichi
Sugaya Yasuhiro
Clark Jasmine J B
Matsushita Electric - Industrial Co., Ltd.
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