Multi layer ceramic electronic parts

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S305000, C361S311000

Reexamination Certificate

active

06344963

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to multi-layer ceramic electronic parts having, for example, a laminated body of internal electrode patterns and ceramic layers therein, at end portions of which are provided external electrodes so as to conduct to the internal electrodes, and in particular to multi-layer ceramic electronic parts in which a material common with the ceramic material for forming the ceramic layers of the laminated body is added into at least a portion of the external electrodes thereof.
2. Description of Related Art
As electronic components of a laminated type can be listed, for example, a laminated capacitor, a laminated inductor, a laminated piezo element, a laminated filter, a ceramic multi-layer circuit board, etc.
For example, in the laminated ceramic capacitor, as being the most representative one of the laminated electronic components, a large number of layers are piled up or laminated, each having an internal electrode and made of dielectric material, wherein the above-mentioned internal electrodes are pulled out one another to the end surfaces of the laminated body opposing to each other. On the end surfaces to which those internal electrodes are pulled out, external electrodes are formed, and those external electrodes are also connected to the above-mentioned internal electrodes, respectively.
The above-mentioned laminated body
3
of the laminated ceramic capacitor has a layer construction as shown in
FIG. 3
, for example. Namely, the ceramic layers
7
,
7
. . . , each having the internal electrode
5
or
6
and made of dielectric material, are laminated in an order as shown in
FIG. 3
, and further, on both sides (i.e., on upper and lower sides) thereof are piled up or laminated the ceramic layers
7
,
7
. . . in a plurality thereof, on which no such the electrode
5
or
6
is formed, respectively. Upon the end portions of the laminated body
3
having such a layer structure therein, the internal electrodes
5
and
6
expose one another, and as shown in
FIG. 1
, the above-mentioned external electrodes
2
and
2
are formed at the end portions of this laminated body
3
.
Such a laminated ceramic capacitor, ordinarily, is not manufactured one by one, in or as a unit of one part as shown in
FIG. 3
, but actually is obtained by a manufacturing method which will be described below. Namely, first of all, minute ceramic powder and organic binder are mixed to prepare a slurry, and it is extended thinly on a carrier film made from a polyethylene terephthalate film, etc., by the doctor blade method. Then, it is dried to be formed into a ceramic green sheet. Next, this ceramic green sheet is cut out into a desired size by a cutting head, while being mounted on the supporting sheet, and is printed with a conductive paste on one side surface thereof by a screen printing method, and is dried. With this, the ceramic green sheets
1
a
and
1
b
are obtained, on each of which plural sets of the internal electrode patterns
2
a
and
2
b
are aligned or arranged in the vertical and horizontal directions, as shown in FIG.
4
.
Next, plural pieces of the ceramic green sheets
1
a
and
1
b
, each having the above-mentioned internal electrode patterns
2
a
or
2
b
thereon, are piled up or laminated, and further are piled several pieces of the ceramic green sheets
1
,
1
. . . not having the internal electrodes
2
a
or
2
b
, at the top and the bottom thereof. They are compressed and put together, thereby forming the laminated body. Here, the above ceramic green sheets
1
a
and
1
b
are piled up on one another, on which the internal electrode patterns
2
a
and
2
b
are shifted by half a length in a longitudinal direction thereof. After that, the laminated body is cut out into a desired size, thereby manufacturing the laminated raw chips, and those raw chips are baked. In this manner are obtained the laminated bodies as shown in FIG.
3
.
Next, this baked laminated body
3
is applied with a conductor paste on both ends thereof and is baked, and on the surface of the baked conductive film is treated a plating, thereby completing the laminated ceramic capacitor formed with the external electrodes at both ends thereof, as shown in FIG.
1
.
The multi-layer ceramic electronic parts, such as the laminated ceramic capacitor mentioned above, is mounted on a circuit board and is soldered at the external electrodes
2
and
2
on both ends thereof on land electrodes of the circuit board.
However, such a laminated ceramic capacitor generates thermal stress within the laminated body
3
due to heat-shock when being soldered at the external electrodes thereof or due to a change of a circumference temperature under the condition of use after the soldering. With this thermal stress, in particular in end portions of the external electrodes
2
and
2
of the laminated body
3
, cracks can easily occur. The cracks occurring in the laminated body
3
bring about a lowering in insulation due to the invasion of moisture inside and a lowering in static capacitance due to discontinuity of the internal electrodes
5
and
6
, thereby causing a low reliability thereof.
Such a thermal stress causing the cracks in the laminated body occurs due to the difference in thermal expansion ratio between the ceramic material, which is a main ingredient for forming the laminated body
3
, and the conductor, which is a main ingredient for forming the external electrodes
2
and
2
. Then, conventionally, a measure was taken, by adding into the conductor paste for forming the external electrodes
2
and
2
the ceramic material for forming the ceramic layer
7
as a common material, thereby minimizing the difference between the ceramic layer
7
and the external electrodes
2
and
2
in physical properties, such as the thermal stress therein.
However, if a large amount of the common material, i.e., the ceramic material for forming the ceramic layer
7
, is put or added into the conductor paste for forming the external electrodes
2
and
2
, stickiness or adhesiveness of the external electrodes
2
and
2
onto the external electrodes
5
and
6
comes to be inferior, i.e., the connecting resistance therebetween becomes large and also the electrical properties thereof deteriorate. Further the stickiness or adhesiveness onto the solder or Sn plating also deteriorates. As a result of this, the solder wetability of the external electrodes
2
and
2
becomes inferior, therefore mis-mounting easily occurs when mounting the multi-layer ceramic electronic parts on the circuit board.
SUMMARY OF THE INVENTION
An object, according to the present invention, for solving the problems in the conventional art mentioned above, is to provide a multi-layer ceramic electronic part, wherein the cracks in the laminated body hardly occur due to heat-shock accompanying a change in temperature under the conditions of being soldered and during the use thereafter, and further, the adhesiveness between the external and internal electrodes and the adhesiveness of solder onto the external electrode are superior, as well, thereby also being superior in soldering property with the external electrodes.
According to the present invention, for achieving the above-mentioned object, a first conductor film
21
containing a relatively small amount of a common material with respect to the conductor component is formed only on the end surfaces of the laminated body
3
, upon which the edges of the internal electrodes
5
and
6
are led out, and a second conductor film
22
containing no common material or containing a very small amount thereof is provided on this first conductor film
21
to cover a portion of the side surfaces adjacent to the laminated body
3
, thereby forming the external electrodes
2
and
2
.
Namely, according to the present invention, there is provided a multi-layer ceramic electronic part, comprising:
a laminated body
3
in which a ceramic layer
7
and internal electrodes
5
and
6
are laminated one another; and
external electrodes
2
and
2
are

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi layer ceramic electronic parts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi layer ceramic electronic parts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi layer ceramic electronic parts will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2940885

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.