Method of fabricating devices incorporating...

Details Method of fabricating devices incorporating... Method of fabricating devices incorporating...

2000-05-23

2002-05-07

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S021000, C438S458000, C438S464000, C438S113000

Reexamination Certificate

active

06383833

ABSTRACT:

CO-PENDING APPLICATIONS
Various methods, systems and apparatus relating to the present invention are disclosed in the following co-pending applications filed by the applicant or assignee of the present invention simultaneously with the present application:
09/575,197
09/575,195
09/575,159
09/575,132
09/575,123
09/575,148
09/575,130
09/575,165
09/575,153
09/575,118
09/575,131
09/575,116
09/575,144
09/575,139
09/575,186
09/575,185
09/575,191
09/575,145
09/575,192
09/575,181
09/575,193
09/575,156
09/575,183
09/575,160
09/575,150
09/575,169
09/575,184
09/575,128
09/575,180
09/575,149
09/575,179
09/575,133
09/575,143
09/575,187
09/575,155
09/575,196
09/575,198
09/575,178
09/575,164
09/575,146
09/575,174
09/575,163
09/575,168
09/575,154
09/575,129
09/575,124
09/575,188
09/575,189
09/575,162
09/575,172
09/575,170
09/575,171
09/575,161
09/575,141
09/575,125
09/575,142
09/575,140
09/575,190
09/575,138
09/575,126
09/575,127
09/575,158
09/575,117
09/575,147
09/575,152
09/575,176
09/575,151
09/575,177
09/575,175
09/575,115
09/575,114
09/575,113
09/575,112
09/575,111
09/575,108
09/575,109
09/575,182
09/575,173
09/575,194
09/575,136
09/575,119
09/575,135
09/575,157
09/575,166
09/575,134
09/575,121
09/575,137
09/575,167
09/575,120
09/575,122
The disclosure; of these co-pending applications are incorporated herein by cross-reference.
FIELD OF THE INVENTION
This invention relates to the fabrication of devices incorporating microelectromechanical systems (MEMS). More particularly, the invention relates to a method of fabricating a MEMS device using at least one UV curable tape. For the sake of brevity, such a device shall be referred to below as a MEMS device and the part of the device comprising the microelectromechanical system shall be referred to as a MEMS layer.
SUMMARY OF THE INVENTION
According to the invention, there is provided a method of fabricating MEMS devices, the method including the steps of:
providing a substrate with a MEMS layer arranged on one side of the substrate;
applying a further layer to said one side of the substrate;
performing at least one operation on the substrate from a side of the substrate opposed to the side having the MEMS layer;
applying a holding means to said opposed side of the substrate;
performing at least one operation on the further layer to define individual chips, each chip being composed of a part of the substrate, at least one part of the MEMS layer and a part of the further layer; and
causing the individual chips to be released from the holding means for removal from the holding means.
The operations performed on the substrate may include separating the substrate into discrete parts, each part carrying said at least one MEMS part.
Similarly, the operations performed on the further layer may include separating the further layer into discrete parts, one part associated with each part of the substrate.
The method may include performing the operations on the further layer after application of the holding means to the substrate.
Preferably, the method includes bonding the holding means to the substrate. Optionally, a handling means may be applied to the holding means. The handling means may impart rigidity to the holding means and may facilitate manipulation of a laminate, the laminate comprising the substrate, the MEMS layer and the further layer.
The holding means may be bonded to the layer by means of an adhesive which is curable by exposure to ultraviolet (UV) light. By “curable” is meant that the adhesive loses its adhesive properties when exposed to UV light. Thus, the method may include exposing localised regions of the holding means to UV light to release one chip at a time from the holding means to enable each chip to be removed individually from the holding means. It will be appreciated that the handling means is transparent to UV light so that UV light is transmitted through the handling means to cure the adhesive of the holding means.
The handling means may be in the form of a glass, quartz, alumina or equivalent wafer.
The method may finally include removing each chip from the holding means by a transporting means.


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