Semiconductor memory device having trenched capicitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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H01L 27108

Patent

active

054282365

ABSTRACT:
Disclosed is a memory having a p-type semiconductor substrate having a high impurity concentration a p-type semiconductor layer is formed on thereof; a groove which is formed so as to extend from a surface of the semiconductor layer to a position inside the semiconductor substrate; an impurity diffused region which is formed on portions of the semiconductor layer and the semiconductor substrate which define the groove; and an electrode which is formed from the groove to level at least above an opening of the groove through capacitor insulation film, the impurity diffused region, capacitor insulation film and electrode constituting trenched capacitor in which the electrode serves first capacitor electrode and the impurity diffused region serves as a second capacitor electrode.

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patent: 4432006 (1984-02-01), Takei
patent: 4538166 (1985-08-01), Nakano
Sunami et al., "A Corrugated Capacitor Cell (CCC) for Megabit Dynamic MOS Memories," IEDM Dig. Tech. Papers, pp. 806-808, Dec. 1982.
Mano et al., "Submicron VLSI Memory Circuits," IEEE International Solid-State Circuits Conference, pp. 234-235, Feb. 1983.
Minegishi et al., "A Submicron CMOS Megabit Level Dynamic RAM Technology Using Doped Face Trench Capacitor Cell," IEDM Dig. Tech. Papers, pp. 319-322, Dec. 5-7, 1983.
"Dynamic random-access memory cell employing V-Groove Connection to buried N + layer and optional oxide capacitor", Chang et al.
Kenney, "Reduced Bit Line Capacitance in VMOS Devices," IBM Tech. Discl. Bull., vol. 23, No. 9, 2/81, pp. 4052-4053.

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