Anti-oxidation system of a wire bonder using a copper wire

Details Anti-oxidation system of a wire bonder using a copper wire Anti-oxidation system of a wire bonder using a copper wire

1989-05-23

1991-02-26

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228 45, 228220, H01L 2160

Patent

active

049955527

ABSTRACT:
An anti-oxidation system of a wire bonder for bonding a wire between a chip pad and a lead frame for a semiconductor device, said wire being comprised of an oxidizable material such as copper or aluminum, wherein a reduction gas for preventing oxidation of the wire is periodically supplied around a spool wound by said wire, at least one gas tube for supplying the reduction gas is disposed towards both sides of a capillary device drawing out the wire, said gas tubes being disposed just beneath the end of capillary device in opposite directions to each other, and a torch being disposed facing with a lower surface of either one of said gas tubes and just beneath the capillary device.

REFERENCES:
patent: 4451541 (1984-05-01), Beal
Metals Handbook Ninth Edition; vol. 6 Welding, Brazing and Soldering; 1983, p. 217.

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