Method of forming a printed circuit

Details Method of forming a printed circuit Method of forming a printed circuit

1979-09-19

1981-04-07

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29847, 156 90, 156151, 156630, 156666, 156901, 156902, 174 685, 204 27, 204 49, 428626, 428639, 428901, B44C 122

Patent

active

042604494

ABSTRACT:
A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant. The preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.

REFERENCES:
patent: 2233546 (1941-03-01), Meulendyke
patent: 2984595 (1961-05-01), Schumpelt et al.
patent: 3466208 (1969-09-01), Slominski
patent: 3585010 (1971-06-01), Luce et al.
patent: 4010005 (1977-03-01), Morisaki et al.

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