Methods of cleaning semiconductor substrates after polishing

Details Methods of cleaning semiconductor substrates after polishing Methods of cleaning semiconductor substrates after polishing

1993-06-15

1995-02-14

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437228, 437946, 252 793, H01L 21306

Patent

active

053891945

ABSTRACT:
A method of cleaning semiconductor substrates after polishing, particularly chem-mech polishing a semiconductor substrate to planarize a layer, to remove excess material from atop a layer, and to strip back a defective layer is disclosed. Aluminum oxide particles having a small, well controlled size, and substantially in the alpha phase provide beneficial results when polishing. A phosphoric acid cleaning solution is used. The aluminum oxide particles are soluble in the phosphoric acid solution, which does not significantly attack silicon dioxide. The phosphoric acid solution can include a small concentration of hydrofluoric acid to aid in removing silicon dioxide detritus from the surface of the wafer.

REFERENCES:
patent: 3753815 (1973-08-01), Burton et al.
patent: 3896254 (1975-07-01), Berkner
patent: 4116714 (1978-09-01), Basi
patent: 4477364 (1984-10-01), Garcia
patent: 4609809 (1986-09-01), Yamaguchi et al.
patent: 4671851 (1987-06-01), Beyer et al.
patent: 4910155 (1990-03-01), Cote et al.
patent: 4944836 (1990-07-01), Beyer et al.
patent: 4956015 (1990-09-01), Okajima et al.
patent: 4956313 (1990-09-01), Cote et al.
patent: 4980019 (1990-12-01), Baerg et al.
patent: 5128081 (1992-07-01), Siegel et al.
patent: 5142828 (1992-09-01), Curry, II
"Stress Related Failures Causing Open Metallization", by Groothuis et al., IEEE/IRPS, 1987, pp. 1-7.

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