Method for providing a deep connection to substrate or...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S510000, C257SE21545, C257SE21546

Reexamination Certificate

active

07348639

ABSTRACT:
A system and method is disclosed for providing a deep connection to a substrate or buried layer of a semiconductor device. Three shallow trenches are etched halfway through a layer of epitaxial silicon that is located on a substrate. A second doped layer is created in the epitaxial silicon layer at the bottom of the central shallow trench. First and third doped layers are created in the epitaxial silicon layer adjacent to the central shallow trench. An oxide layer is then deposited to fill the three trenches. The second doped layer is diffused vertically down to the substrate. The first and third doped layers are diffused vertically down to the second doped layer. Lateral diffusion of the first and third doped layers is constrained by the oxide layer in the three trenches.

REFERENCES:
patent: 4140558 (1979-02-01), Murphy et al.
patent: 5780340 (1998-07-01), Gardner et al.
patent: 6833592 (2004-12-01), Lee
patent: 6927459 (2005-08-01), Hokazono et al.
patent: 6958518 (2005-10-01), Wylie
patent: 7223647 (2007-05-01), Hsu et al.

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