Thermal processing apparatus and thermal processing method

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

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Details

C219S390000, C219S405000, C392S416000, C392S418000, C118S724000, C118S725000, C118S050100

Reexamination Certificate

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07381928

ABSTRACT:
A light source including a plurality of flash lamps emits flashes thereby flash-heating a semiconductor wafer held by a thermal diffuser and a hot plate. The current distance of irradiation between the thermal diffuser and the hot plate holding the semiconductor wafer and the light source is so adjusted as to attain predetermined intensity of irradiation. The distance of irradiation between the thermal diffuser and the hot plate and the light source can be changed or corrected by vertically moving the thermal diffuser and the hot plate. The thermal processing apparatus which uses the flash lamps, is thus capable of readily controlling the intensity of irradiation.

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patent: P3 281018 (2002-02-01), None
U.S. patent No. 4,859,832 enclosed herewith corresponds to untranslated Japanese patent application laid-open No. 63-066930.
Untranslated Korean Office Action issued May 30, 2005 against counterpart Korean application No. 10-2003-0066756 citing U.S. patent No. 5,444,217.
English translation of Abstract for Japanese Patent Application Laid-Open No. 2001-237195.
English translation of Abstract for Japanese Patent Application Laid-Open No. 3281018 (2002).
English translation of Abstract for Japanese Patent Application Laid-Open No. 61-198735 (1986).
English translation of Abstract for Japanese Patent Application Laid-Open No. 62-26571 (1987).
English translation of Abstract for Japanese Patent Application Laid-Open No. 57-162340 (1982).

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