Method and apparatus for inspecting pattern defects

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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Details

C348S087000, C348S092000, C348S126000, C356S237400, C356S237500, C382S144000, C382S195000, C382S218000, C382S224000, C700S121000

Reexamination Certificate

active

07388979

ABSTRACT:
The present invention relates to a pattern defect inspection method and apparatus that reveal ultramicroscopic defects on an inspection target in which ultramicroscopic circuit patterns are formed, and inspect the defects with high sensitivity and at a high speed. The present invention provides a pattern inspection apparatus for comparing the images of corresponding areas of two formed patterns that should be identical with each other, and judging any mismatched image area as a defect. The pattern inspection apparatus includes means for performing an image comparison process on a plurality of areas in a parallel manner. Further, the pattern inspection apparatus also includes means for converting the gradation of the image signals of compared images in each of a plurality of different processes. Therefore, the present invention can properly detect defects even if the same patterns of compared images differ in brightness.

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