Method of fabricating a fin field effect transistor in a...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S283000, C257SE21051

Reexamination Certificate

active

07316945

ABSTRACT:
A method for fabricating a fin FET in a semiconductor device. The method includes sequentially depositing first and second insulation films on a semiconductor substrate, etching the first and second insulation films using a first mask to form a trench, and depositing a first conductor in the trench.

REFERENCES:
patent: 6946377 (2005-09-01), Chambers

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating a fin field effect transistor in a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a fin field effect transistor in a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a fin field effect transistor in a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2809657

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.