Method of fabricating memory device utilizing carbon nanotubes

Semiconductor device manufacturing: process – Making passive device

Reexamination Certificate

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C438S238000, C438S513000, C438S680000, C257SE21008, C257S017000, C257S041000, C257S277000, C257S645000, C257SE51008, C257S004000, C257S038000, C257SE23007, C257S074000, C257S165000

Reexamination Certificate

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07378328

ABSTRACT:
A fast, reliable, highly integrated memory device formed of a carbon nanotube memory device and a method for forming the same, in which the carbon nanotube memory device includes a substrate, a source electrode, a drain electrode, a carbon nanotube having high electrical and thermal conductivity, a memory cell having excellent charge storage capability, and a gate electrode. The source electrode and drain electrode are arranged with a predetermined interval between them on the substrate and are subjected to a voltage. The carbon nanotube connects the source electrode to the drain electrode and serves as a channel for charge movement. The memory cell is located over the carbon nanotube and stores charges from the carbon nanotube. The gate electrode is formed in contact with the upper surface of the memory cell and controls the amount of charge flowing from the carbon nanotube into the memory cell.

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Tans, S.J. “Room-temperature transistor based on a single carbon nanotube”, NATURE, 393:49-52 (May 7, 1998).
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Choi, W.B., et al., “Carbon-nanotube-based nonvolatile memory with oxide-nitride-oxide film and nanoscale channel”, Applied Physics Letters, 82(2):275-277, (Jan. 13, 2003).

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